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        <datestamp>2026-10-01T06:57:22Z</datestamp>
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          <dc:title>Photonic integrated circuit enabled light engines for augmented reality glasses</dc:title>
          <dc:creator>Hannes Wahn (15341854)</dc:creator>
          <dc:creator>John Straguzzi (21440861)</dc:creator>
          <dc:creator>Hongyao Chua (14359359)</dc:creator>
          <dc:creator>Guo-Qiang Lo (3982841)</dc:creator>
          <dc:creator>Wesley Sacher (4418479)</dc:creator>
          <dc:subject>Integrated Optics</dc:subject>
          <dc:subject>Silicon Photonics</dc:subject>
          <dc:subject>Augmented Reality</dc:subject>
          <dc:subject>Visible Light Photonics</dc:subject>
          <dc:description>Laser beam scanning (LBS) light engines offer inherent advantages in power efficiency and brightness for augmented-reality (AR) glasses. However, conventional implementations rely on complex assemblies of discrete components that are difficult to miniaturize while simultaneously increasing resolution and frame rate. Here, we introduce a compact LBS light-engine architecture enabled by a photonic integrated circuit (PIC) operating in an inline double-pass configuration and validate the approach with proof-of-concept prototypes. The PIC incorporates a thinned bridge positioned in the optical path of a lens and a scanning microelectromechanical-systems (MEMS) mirror. Multiple beams emitted from on-chip silicon nitride nanophotonic waveguides enable parallel addressing of the field of view, providing a route to higher resolution and frame rates at fixed MEMS-mirror performance while also expanding the field of view for a given mirror-deflection range. A curved bridge geometry, co-designed with the lens, further facilitates correction of optical aberrations. Compared with conventional single-pass laser-scanning light engines based on discrete optical components, the proposed architecture reduces system size through a shortened double-pass optical path and compact nanophotonic beam routing, while providing a scalable PIC platform for future integration of multiple on-chip lasers. The PICs were foundry-fabricated on 200-mm silicon-on-insulator wafers using a visible-light integrated-photonics platform, underscoring the potential for manufacturing at scale. Together, these features establish a pathway toward addressing the size-performance trade-offs associated with laser-scanning AR displays.</dc:description>
          <dc:date>2026-10-01T06:57:22Z</dc:date>
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          <dc:identifier>10.1364/opticaopen.33966367.v1</dc:identifier>
          <dc:relation>https://figshare.com/articles/preprint/Photonic_integrated_circuit_enabled_light_engines_for_augmented_reality_glasses/33966367</dc:relation>
          <dc:rights>CC BY 4.0</dc:rights>
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