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        <identifier>oai:figshare.com:article/33881011</identifier>
        <datestamp>2026-09-17T09:41:05Z</datestamp>
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          <dc:title>Data for Influence of co-reactants on surface passivation by nanoscale hafnium oxide layers grown by atomic layer deposition on silicon</dc:title>
          <dc:creator>Sophie L. Pain (11896239)</dc:creator>
          <dc:creator>Edris Khorani (24860734)</dc:creator>
          <dc:creator>Anup Yadav (24860731)</dc:creator>
          <dc:creator>Tim Niewelt (24860737)</dc:creator>
          <dc:creator>Antonio Leimenstoll (25010257)</dc:creator>
          <dc:creator>Brendan F. M. Healy (20979829)</dc:creator>
          <dc:creator>Marc Walker (1429663)</dc:creator>
          <dc:creator>David Walker (36297)</dc:creator>
          <dc:creator>Nicholas E. Grant (6877136)</dc:creator>
          <dc:creator>John D. Murphy (6877151)</dc:creator>
          <dc:subject>Atomic layer deposition</dc:subject>
          <dc:subject>Hafnium oxide</dc:subject>
          <dc:subject>Silicon</dc:subject>
          <dc:subject>Dielectrics</dc:subject>
          <dc:subject>Migrated from ePrints</dc:subject>
          <dc:description>Hafnium oxide thin films have attracted considerable interest for passivation layers, protective barriers, and anti-reflection coatings. Atomic layer deposition offers a route to produce conformal films at the nanometre scale, but there is a lack of clarity over how the growth conditions affect the film properties. Here we present a study into the role of different co-reactants (O2 plasma, O3 and H2O) for the atomic layer deposition of HfOx on n-type silicon from a tetrakis(dimethylamido)hafnium (TDMAH) precursor at 200 °C followed by post-deposition annealing (up to 500 °C). Through X-ray diffraction and X-ray photoelectron spectroscopy, we demonstrate variations in film composition, stoichiometry and crystallinity with co-reactant. Depth profiling conducted with X-ray photoelectron spectroscopy reveals differences in composition between the HfOx surface and the HfOx/Si interface. We also determine differences in the charge level and chemical passivation through photoconductance decay measurements and Kelvin probe analysis. We find that surface recombination velocities &lt;10 cm s-1 are possible for HfOx films, with the best passivation achieved for H2O-based HfOx (SRVs as low as ~5 cm s-1). We show that with TDMAH as a hafnium precursor, neither co-reactant choice nor annealing ambient influence resulting charge polarity.&lt;br&gt;&lt;br&gt;Dataset to support a publication in RSC Applied Interfaces.</dc:description>
          <dc:date>2023-12-13T00:00:00Z</dc:date>
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          <dc:identifier>10.82444/warw.33881011.v1</dc:identifier>
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          <dc:rights>CC BY 4.0</dc:rights>
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